HFZ-SERIES

芯片磁珠在EMI應用市場上一直扮演的重要角色，不論任何的電子產品，總是需要芯片磁珠的挹注，方能做到完善的電磁兼容，在避免訊號失真的同時，更減少影響到生活周邊的各項電子設施。

Chip beads have always played an important role in the EMI suppression application. Regardless of any electronic products, the use of chip beads are always required to achieve perfect electromagnetic compatibility. While avoiding signal distortion, it also reduces the EMI noise that may impact on surrounding electronic products.

芯片磁珠主要材料組成包含了鐵氧體、銀、鎳、錫等，而磁珠生產透過使用不同的鐵氧體材料使得在不同的頻率應用下，有效解決EMI各項問題。

The main material composition of ferrite chip beads includes ferrite, silver, nickel, tin, etc., and the production of chip beads use different ferrite materials to effectively solve various EMI problems under different frequency applications.

隨著科技的日新月異，電子市場上充斥各類不同型態的產品，各個生產廠商無所不用其極的希望自家產品都能夠做到產品的獨創性、與他人的差異性、當然更重要的還是需要做到產品的微型化。

With the rapid development of technology, the electronic market is flooded with various types of products. Each manufacturer hopes that their products can achieve uniqueness and differentiation from others, and of course, the miniaturization of the products is also important.

臺慶科所推出的新型芯片磁珠產品HFZ-SERIES，透過臺慶科自行設計的自動化生產機具，加上特制鐵氧體及其他材料搭配，找正品元器件，上唯樣商城，成功優化產品性能，并且產品經過車用等級AEC-Q200的嚴格檢測要求，更是有效利用于汽車電子市場。

TAI-TECH’s Technology has introduced a new type of chip bead product, the HFZ-SERIES, which optimizes product performance through its self-designed automated production equipment, special ferrite and other materials. The product has also passed strict reliability testing requirements, such as the automotive-grade AEC-Q200 standard, making it effective to apply in the automotive electronics application.

HFZ具備著低直流阻抗的產品特性，使得產品應用溫度更加具有彈性，小型化大電流的產品設計也為工程師LAYOUT設計增加更多利用率，也減少材料成本。

HFZ Series features low DCR, and it effectively performs compact size and high current performance with wide operating temperature range, which is flexible and high utilization for engineer’s PCB layout design, and cost saving.

The use of HFZ-series can reduce both the size and the cost, which avoid the impact of material price fluctuations.

HFZ is smaller in size, and also provides a better temperature rise performance.

產品特點

1、適用于 -55°C ~ 125°C度操作溫度范圍

Operating temperature -55°C ~ 125°C

2、符合 RoHS、 REACH 、Lead Free等環境要求

100% Lead (Pb) & Halogen-Free and REACH & RoHS compliant.

3、產品低直流阻抗、低損耗

Low DCR & Low loss

4、適用于波鋒焊制程應用

Suitable for wave soldering process applications

5、符合車用等級 AEC-Q200測試要求

Reliability test complied with AEC-Q200.

主要產品規格特性

審核編輯 黃宇